Beckwith, J. K., Ganesan, M., VanEpps, J. S., Kumar, A. & Solomon, M. J., “Rheology of Candida albicans fungal biofilms”, Journal of Rheology 66, 683–697 (2022).
Liu, T., Liu, T., Gao, F., Glotzer, S. C. & Solomon, M. J., “Structural Color Spectral Response of Dense Structures of Discoidal Particles Generated by Evaporative Assembly”, J. Phys. Chem. B 126, 1315–1324 (2022).
Kao, P.K., Solomon, M. J. & Ganesan, M., “Microstructure and elasticity of dilute gels of colloidal discoids”, Soft Matter 18, 1350–1363 (2022).
Liu, T., VanSaders, B., Keating, J. T., Glotzer, S. C. and Solomon, M. J., “Effect of Particles of Irregular Size on the Microstructure and Structural Color of Self-Assembled Colloidal Crystals”, Langmuir 37, 13300–13308 (2021).
Rocklin, D.Z., Hsiao, L., Szakasits, M., Solomon, M.J. and Mao, X., “Elasticity of colloidal gels: structural heterogeneity, floppy modes, and rigidity”, Soft Matter 17, 6929-6934 (2021)
Vitale, C., Ma, T.M., Sim, J., Altheim, C., Martinez-Nieves, E., Kadiyala, U., Solomon, M.J. and VanEpps, J.S., “Staphylococcus epidermidis has growth phase dependent affinity for fibrinogen and resulting fibrin clot elasticity”, Frontiers in Microbiology , 12, (2021)
Kao, P.K., VanSaders, B.J., Glotzer, S.C. and Solomon, M.J., “Accelerated annealing of colloidal crystal monolayers by means of cyclically applied electric fields”, Scientific Reports, 11:11042 (2021).
Saud, K.T., Ganesan, M. and Solomon, M.J., “Yield stress behavior of colloidal gels with embedded active particles”, Journal of Rheology, 65, 225 – 239 (2021).
Beckwith, J., VanEpps, J.S. and Solomon, M.J., “Differential effects of heated perfusate on morphology, viability, and dissemination of Staphylococcus epidermidis biofilms”, Applied and Environmental Microbiology, DOI: 10.1128/AEM.01193-20 (2020).
Liu, T., VanSaders, B.J., Glotzer, S.C. and Solomon, M.J., “Effect of defective microstructure and film thickness on the reflective structural color of self-assembled colloidal crystals”, ACS Applied Materials & Interfaces, 12 (8), 9842-9850 (2020).